職務要求
                    - Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication. 
- Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools.
- Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction.
- Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications. 
- Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance. 
- Oversee process validation and testing, ensuring compliance with industry standards. 
- Regularly interface with customers to understand their challenges and tailor solutions that meet their needs. 
- Stay updated on the latest industry trends and technical advancements, ensuring the company's offerings remain competitive.
                    
任職資格
                    - Master’s degree in Engineering related field or Material Science. 
- Minimum 6 years of experience in semiconductor lithography and bonding processes. 
- Minimum 3 years of team management experience. 
- Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing. 
- Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams. 
- Fluent in English; knowledge of Mandarin is an advantage.
                    
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