新竹縣竹北市
其他半導體相關
半導體工程研發主管
面議（經常性薪資4萬含以上）
- Master’s degree in Engineering related field or Material Science.
- Minimum 6 years of experience in semiconductor lithography and bonding processes.
- Minimum 3 years of team management experience.
- Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing.
- Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams.
- Fluent in English; knowledge of Mandarin is an advantage.