職務要求

- Lead the service team in Taiwan, providing technical support, preventive maintenance, and repairs for lithography and bonding systems.

- Ensure high-quality and timely customer service for products, including coaters, developers, and wafer bonders.

- Collaborate with the application engineering team to resolve technical issues and optimize equipment performance at customer sites.

- Manage and monitor service contracts, warranties, and spare parts inventory to ensure availability and timely service interventions.

- Conduct on-site troubleshooting, diagnostics, and repairs, ensuring minimal downtime for customer operations.

- Develop and deliver training programs for customers on the use and maintenance of equipment.

- Maintain service documentation, track key performance indicators (KPIs), and report on service activities to management.

- Work closely with customers to understand their technical challenges and provide proactive solutions.

- Coordinate with the global service and support team to share best practices and ensure consistent service quality.

任職資格

- Bachelor's degree or Master degree in Engineering field.

- Minimum of 5 years of service or technical support experience, preferably within the semiconductor or high-tech equipment industry.

- Minimum of 2 years service management proved experience

- Strong technical knowledge of semiconductor lithography and bonding processes and equipment.

- Proven experience in customer service management and troubleshooting complex technical issues.

- Excellent communication and leadership skills, with the ability to lead a team and engage effectively with customers.

- Fluent in English and Mandarin, with strong documentation and reporting skills.

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