Application Engineer-Bonder(新竹)(3008899)
新竹縣竹北市
其他半導體相關
半導體工程師
面議(經常性薪資4萬含以上)
任職資格
• Conduct and complete final acceptance test at customer site.

• Establish process and qualify bonding systems with customer.

• Collaborate with customer in defining problem statements, analyzing abnormal data, resolving process issues, and improving process conditions.

• Provide both on-site and remote applications support to customers.

• Participate in customer meetings and maintain positive relationship with customer contacts.

• Provide expertise and advice to bonder business unit to help product improvement.

• Participate in projects related to new product introduction: definition, characterization, alpha testing, beta testing and customer use case development

• Learn new products through daily work and training events; is required to attend training events upon arrangement.

• Take ownership of application projects assigned by supervisor.

• Other tasks are assigned by supervisor

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