職務要求

- Lead and manage application engineering teams focusing on lithography and wafer bonding technologies for semiconductor advanced package fabrication.

- Provide technical expertise and support to customers in Taiwan regarding the usage and optimization of equipment, including mask aligners, coaters, developers, and wafer bonding tools.

- Collaborate with R&D teams to implement customer-specific solutions, improving product performance and enhancing customer satisfaction.

- Drive the development and integration of new processes for 3D packaging, TSV (Through-Silicon Via) bonding, and other advanced semiconductor applications.

- Conduct customer training sessions, troubleshooting, and technical support to ensure optimal equipment performance.

- Oversee process validation and testing, ensuring compliance with industry standards.

- Regularly interface with customers to understand their challenges and tailor solutions that meet their needs.

- Stay updated on the latest industry trends and technical advancements, ensuring the company's offerings remain competitive.

任職資格

- Master’s degree in Engineering related field or Material Science.

- Minimum 6 years of experience in semiconductor lithography and bonding processes.

- Minimum 3 years of team management experience.

- Strong problem-solving skills, with the ability to troubleshoot technical issues in semiconductor processing.

- Excellent communication and interpersonal skills to effectively interact with customers and cross-functional teams.

- Fluent in English; knowledge of Mandarin is an advantage.

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