現有獵頭工作

1. 需具遺傳諮詢師證書 2. 需具遺傳諮詢相關經驗 3. 英文中等以上，能閱讀原文報告、醫療期刊，藥廠外籍主管基本溝通 4. Excel、簡報、文件管理能力

1. 5+ years professional software development expertise.( Git、PHP、Python、MS SQL、RDBMS、AWS、Angular) 2.Knowledge of technological trends (open source) to leverage to the existing data management platform. 3..BA in Computer Science, Engineering or a related field. 4. Solid understanding of software development lifecycle and agile methodologies. 5.Self-motivated and action-oriented with ability to work in a fast-paced start-up environment. 6.Good knowledge and experience with git version control and software development flow. 加分項目 1.Experience with front-end frameworks like Vue, React or Angular as well as component libraries like Bootstrap, Semantic or Material 2.Experience of developing backend APIs using any language and web frameworks. 3.Experience of deploying production-level code to a cloud environment such as AWS or GCP 4.Experience with any RDBMS and knowledge on SQL optimization and relational data structure design

1. 對REVIT有基礎認識操作，看得懂模型 2. 專業文件撰寫能力(BMP，REPORT) 3. 具專案管理、圖面整合規劃能力 4. 具談判協商能力

1. 對REVIT有基礎認識操作，看得懂模型 2. 專業文件撰寫能力(BMP，REPORT) 3. 具專案管理、圖面整合規劃能力 4. 具談判協商能力 加分條件： 1. 具工地現場實務經驗佳

1. 擅長 MEP REVIT 建置 2. 具備品質檢查的能力 3. 具溝通表達、團隊合作能力 加分條件： 1. 具工地現場實務經驗佳 2. 開創性格、樂於接受挑戰

1. Experience developing and performing reliability tests including (but not limited to) mechanical, shock, vibration, environmental, and characterization testing 2. Knowledgeable of failure analysis techniques including (not limited to) optical microscopy, X-Ray, CT scan, SEM, EDX, and FTIR 3. Knowledgeable of industry test standards including ASTM, MIL, JEDEC, and IEEE 4. BS or higher in Mechanical Engineering, Materials Science, or equivalent discipline 5. Minimum 8 years’ experience, including least 3+ years of experience in reliability engineering 6. Fundamentally strong knowledge of mechanical design, material science, and failure mechanisms of consumer electronics 7. Timely execution of tasks to meet critical deadlines 8. Ability to independently manage multiple tasks in a dynamic environment while maintaining a strong attention to detail 9. Good English communication skills. Frequent conference calls (even daily) with US compliance team mandatory.

1. Bachelor’s degree in Technical degree 2. 5+ years of Linux and MySQL experience. (CentOS/Ubuntu). 3. 3+ years of scripting experience (Python, Docker, SNMP). 4. 3+ years of experience in configuration management (Chef, Puppet, SCCM). 5. Solid understanding of server hardware and sizing, hypervisor technologies (VMware ESX/ ESXi/ vSphere), and cross-platform integrations (i.e. heterogeneous operating system support) 6. Solid understanding of IDF server room design, requirements, operation 7. 3+ years of experience with networking principles, firewalls, load balancers 8. Basis English---oral and written

1. 具備5年以上工作經驗，有金融相關產業經驗尤佳。 2. 有擔任過金融業之招募人員。 3. 必須能推薦或轉介業務人員成為公司通路。

1. Minimum 8 years’ experience with a heavy emphasis on a) EMI/EMC/RF debug experiences; b) US head office support; c) Strong cellular (5G, LTE), WLAN compliance background 2. Have strong wireless experiences with cellular (LTE, 5G), WiFi (802.11 a/b/g/n dual band must; 802.11ax/e preferred), BT (LE/classic) devices with the emphasis on the wireless cellular compliance background; 3. Must have prior experiences working with consumer electronics devices that have wireless regulatory,industry cert, FCC, CE, safety, environmental compliance. 4. Have experiences supporting US-based compliance team in IT company (highly desireable). 5. Have prior submission experiences of wireless products to the regulatory bodies (FCC, TCB, NB). 6. Must have demonstrated experiences taking consumer electronics products to 3rd party test labs in Asia (Taiwan, or China). 7. Travels between China and Taiwan required 8. Good English communication skills. Frequent conference calls (even daily) with US compliance team mandatory.

1.Bachelor’s or MS degree in electrical, mechanical, or manufacturing engineering. 2.4+ years of experience in consumer electronic product development & volume manufacturing 3.Experienced with domestic and/or international consumer electronics vendors and supply chain 4.Understanding of fundamental considerations of building hardware in development and volume production stages. 5.Experienced in managing detail test coverages and improving test efficiency in engineering and production phase 6.Experienced in Optical, Audio, RF testing, preferably has in-depth understanding in one or more of these areas 7.Fluent in English – verbal and written

1.學歷: 大專以上學歷 2.語言: 英文中等 3.擅長工具: C# 或 Delphi 或 Java其中之一 4.工作技能: a.曾參與應用系統後端開發 b.曾使用 SSRS 或 Crystal Report 或 其它報表開發工具開發報表

1.學歷: 大學畢業 2.語言: 英文精通 3.人格特質: a.個性積極主動、熱愛自我學習為必要 有溝通的自信與能力 對專案進度有高度掌握力 b.有熱情學習CRM相關知識與技術 具備團隊精神與領導能力 具備良好分析能力，可建立流程與方法 4.工作地: 台北

1.5+ years of experience in production start-up, electronics manufacturing and/or manufacturing engineering, or operations program/project management, better to have the experience with micro-electronics manufacturing 2.Ability to drive and monitor continuous improvement by applying Lean Six Sigma tools and initiatives. 3.Ability to lead a complex project with Operations focus from new product development thru fulfillment of mature products 4.Ability to analyze and act to mitigate risk 5.Ability to implement, track, and manage cost controls to meet negotiated cost reduction objectives 6.Ability to lead a matrixed, cross-functional team to achieve desired schedule, cost, and quality targets 7.Excellent organization and communications skills are desired 8.PC literacy with competency in MS Office, project management, product collaboration SW 9.Bachelor’s degree in a technical field(hardware oriented EE, ME or IE) 10.Knowledge in ERP software tools with strong preference for Oracle and Agile experience 11.Good communication skill via English & Chinese (verbal / written), Thai as the plus 12.Ability to travel up to 75% of the time in Taiwan and worldwide.

1.8+years’ Quality Assurance in electronics manufacturing environment (OEM, ODM or EMS), Familiar with SMT and final assembly process 2.Inspection of electronic, mechanical and electro-mechanical assemblies as well as cable assemblies 3.Experience in First Article (FAI), Source Inspection (SI), Receiving Inspection (RI) 4.Knowledge of QA process with non-conforming material and MRB 5.Use of mechanical and optical measurement tools 6.Geometric dimensioning and tolerances 7.Supplier evaluation, approval and corrective and preventative actions 8.Ability to interpret engineering and assembly drawings, schematics for PCB’s and PCBA’s 9.Familiar with IPC-A-600 and 610 standards. 10.Experience in managing outsourced manufacturing suppliers. 11.Experience in customer interaction 12.ISO9001:2015 13.AS9100 14.RoHS, REACH 15.Mandarin and English Proficiency (Verbal and Written)

1.5+ years’ RF Test Engineering in an electronics manufacturing environment 2.Proficiency with programming in one or more languages such as LabVIEW, C, C#, Python, or C++ 3.Bachelor's degree in Computer Science, Electrical Engineering or related engineering degree 4.Experience with RF test and measurement equipment: Spectrum Analyzers, Network Analyzers, Signal Generators, Power Meters, etc. 5.Ability to interpret engineering and assembly drawings, schematics for PWB’s and PWA’s 6.Require knowledge in statistical methods (GRR, CPK) for data analysis in production control processes 7.Strong oral and written communication in English 8.Excellent interpersonal and communication skill with capability to work independently 9.Ability to travel to US for training Preferences 1.Working knowledge of RF amplifiers, mixers, oscillators, and transceivers 2.Having knowledge of 28~31GHz range 3.Working knowledge of programming and controlling test equipment 4.Working knowledge of object-oriented programming 5.Previous circuit design experience for frequencies above 10GHz 6.Master’s degree in Computer Science, Electrical Engineering or equivalent experience

1.Bachelor’s degree in electrical, mechanical, or manufacturing engineering 2.8+ years of experience in manufacturing and hardware development of electronic products 3.Familiarity with manufacturing & SMT assembly process 4.Familiarity with Industry standards as they apply to circuit card and mechanical fabrication and assembly (IPC, JSTD, ASME, etc.) 5.Familiarity with properties and processes used in PWA assembly (Screen printing, SPI, pick and place, reflow oven, AOI, AXI, FPT, and ICT) 6.Understanding of lab analysis on PWB/A for DFX or failure 7.Familiarity with analytical tools and or failure analysis techniques (such as SEM, FTIR, Strain Gauge Analysis, EDX, SAM, and Optical Microscopy) 8.Experience with semiconductor/MEMS/GaN/GaAs process flows 9.Familiarity with Minitab, Mentor Graphics, Valor, Agile, and Oracle as plus 10.Familiarity with flex and rigid flex fabrication as plus 11.Ability to travel up to 50% domestic and international 12.Proficiency in English to be able to conduct technical and business discussions in the resource’s related field 13.Mandarin and English, Ability to influence through excellent written and verbal communications skills

1. 具備基礎電腦知識，基本EXCEL、WORD表格製作。 2. 有責任感與良好溝通能力，抗壓性高、細心勤快、負責任。 3. 作業細心、耐心，有服務熱忱，態度溫和有禮，喜歡與人互動。 4. 對語言表達具有敏銳度，口齒清晰。

1.具備基礎電腦知識 2.有責任感與良好溝通能力，抗壓性高、細心勤快、負責任 3.英文(Toeic 400-600)，若能與外國人溝通加分

1.韓文精通 2.具備TOPIK相關證照

1.越文精通 2.過往有客服經驗加分