現有獵頭工作

1.BS or MS in Mechanical Engineering; or the equivalent in experience and evidence of exceptional ability 2.Outstanding design, packaging and 3D modeling skills - we use Solidworks / Onshape and consider candidates with strong capability in any other CAD package 3. Have 3+ years management experience. 4. Have knowledge of materials properties (metal, plastic, composite material), applications, and manufacturing processes (CNC, welding, laser cutting,3D printing, injection molding, stamping, die casting, etc.) 5. Experience with the DFMEAs, failure root-cause analysis is a plus. 6. Demonstrable motivation and ability to solve novel, difficult design problems with tight timing constraints 7. Good communication skill in Chinese and English. 8. Good leadership.

1. 熟悉資訊安全規劃和防火牆/伺服器管理。 2. 具跨國網路維運與建置經驗佳。 3. 具備整體廠房網路與主機規劃與建置經驗。 4. 積極且具服務熱忱、重視團隊合作、思考邏輯清晰、具有良好溝通、協調、組織 管理及領導能力。 5. 初期以培訓為主，視培訓情況調整工作內容。

1.5+ years of experience in production start-up, electronics manufacturing and/or manufacturing engineering, or operations program/project management, better to have the experience with micro-electronics manufacturing 2.Ability to drive and monitor continuous improvement by applying Lean Six Sigma tools and initiatives. 3.Ability to lead a complex project with Operations focus from new product development thru fulfillment of mature products 4.Ability to analyze and act to mitigate risk 5.Ability to implement, track, and manage cost controls to meet negotiated cost reduction objectives 6.Ability to lead a matrixed, cross-functional team to achieve desired schedule, cost, and quality targets 7.Excellent organization and communications skills are desired 8.PC literacy with competency in MS Office, project management, product collaboration SW 9.Bachelor’s degree in a technical field(hardware oriented EE, ME or IE) 10.Knowledge in ERP software tools with strong preference for Oracle and Agile experience 11.Good communication skill via English & Chinese (verbal / written), Thai as the plus 12.Ability to travel up to 75% of the time in Taiwan and worldwide.

1.8+years’ Quality Assurance in electronics manufacturing environment (OEM, ODM or EMS), Familiar with SMT and final assembly process

1.5+ years’ RF Test Engineering in an electronics manufacturing environment 2.Proficiency with programming in one or more languages such as LabVIEW, C, C#, Python, or C++ 3.Bachelor's degree in Computer Science, Electrical Engineering or related engineering degree 4.Experience with RF test and measurement equipment: Spectrum Analyzers, Network Analyzers, Signal Generators, Power Meters, etc. 5.Ability to interpret engineering and assembly drawings, schematics for PWB’s and PWA’s 6.Require knowledge in statistical methods (GRR, CPK) for data analysis in production control processes 7.Strong oral and written communication in English 8.Excellent interpersonal and communication skill with capability to work independently 9.Ability to travel to US for training Preferences 1.Working knowledge of RF amplifiers, mixers, oscillators, and transceivers 2.Having knowledge of 28~31GHz range 3.Working knowledge of programming and controlling test equipment 4.Working knowledge of object-oriented programming 5.Previous circuit design experience for frequencies above 10GHz 6.Master’s degree in Computer Science, Electrical Engineering or equivalent experience

1.Bachelor’s degree in electrical, mechanical, or manufacturing engineering 2.8+ years of experience in manufacturing and hardware development of electronic products 3.Familiarity with manufacturing & SMT assembly process 4.Familiarity with Industry standards as they apply to circuit card and mechanical fabrication and assembly (IPC, JSTD, ASME, etc.) 5.Familiarity with properties and processes used in PWA assembly (Screen printing, SPI, pick and place, reflow oven, AOI, AXI, FPT, and ICT) 6.Understanding of lab analysis on PWB/A for DFX or failure 7.Familiarity with analytical tools and or failure analysis techniques (such as SEM, FTIR, Strain Gauge Analysis, EDX, SAM, and Optical Microscopy) 8.Experience with semiconductor/MEMS/GaN/GaAs process flows 9.Familiarity with Minitab, Mentor Graphics, Valor, Agile, and Oracle as plus 10.Familiarity with flex and rigid flex fabrication as plus 11.Ability to travel up to 50% domestic and international 12.Proficiency in English to be able to conduct technical and business discussions in the resource’s related field 13.Mandarin and English, Ability to influence through excellent written and verbal communications skills

1. 理工科系畢業 2. 具電子相關產業OEM及ODM業務經驗3年以上 3. 英文流利

1.理工科系、半導體產業經驗尤佳 2.具產品開發、製程開發經驗3年以上，英文中等能基本溝通。

1.熟悉AutoCAD繪圖操作 2.相關行業有經驗2年以上

1. 至少3年以上的PHP項目研發經驗； 2. 熟練使用Linux系統，熟悉在Linux配置PHP+MySQL的運行環境 3. 熟練掌握Oracle或mysql等資料庫和SQL程式設計語言； 有高併發處理有經驗者優先；在Redis、Mongo或MemeryCache等緩存技術方面有經驗者優先 4. 熟練掌握thinkphp、yii、Larvel、phpcms、phpwind等框架至少一種，並且至少熟悉一種PHP的MVC框架 5. 熟悉LINUX和WINDOWS作業系統和Apache、NGINX容器配置和優化

1. 熟悉HTML5等Web開發技術； 2. 熟悉Vue.js框架，並有實際開發經驗； 3. 有較好的團隊合作精神，較好的溝通協調能力。

1.5年以上品管或製程開發實務經驗,具螺絲或汽機車業經驗尤佳 2.具備各式機械加工,熱處理與表面處理工作原理認識與運用 3.具團隊部門管理經驗至少2年 4.IATF16949/APQP/PPAP/FMEA/SPC

1. 人資相關工作經驗10年以上 2. 具上市櫃公司人資專案規劃與推動實務經驗，並具實際績效 3. 曾任上市櫃公司基層(含)以上主管 4. 具外派經驗者佳 5. 英語多益成績600分以上 6. 良好的excel等辦公軟體及HRIS操作運用技能 7. 具備良好的人際溝通技能

1. 擔任過100人以上企業總經理或事業單位最高主管資歷3年以上 2. 熟悉光電(面板周邊)、半導體、電子零組件…等高科技產業鏈。 3. 具產業開發嗅覺與實績者(初試時需進行ppt簡報)。 4. 工作態度積極、富使命感，且願意投入心力促成有效人際(業務)溝通。

1.需具備樂觀進取，認真負責與抗壓性高。 2.有開發經驗/管理經驗

1.熟悉電子、光電、工業材料、PCB或半導體產業。 2.具備前開產業企劃或財務管理工作經驗10年以上者佳。 3.具備獨立經營企劃能力

人資3年以上工作經驗(針對軟體工程師招募經驗強)

1. 具備5年以上前端開發經驗，熟悉主流的前端框架Vue/React/Angular. 2. 精通JavaScript/TypeScript/CSS3/HTML5/NodeJS/ES6等前端技術,具備跨終端的前端開發能力，有完整項目經驗. 3. 熟悉JSON / Protobuf等種網路通信技術和資料交換格式. 4. 具備良好的演算法基礎和清晰的程式設計思路，了解一門後端語言. 5. 精通至少一種常見的MVVM框架，精通HTTP及相關網絡協議，熟悉跨終端、跨瀏覽器的開發模式和平台特性. 6. 熟悉前端模塊化、工程化、編譯構建工具，如webpack,grunt,gulp等，熟悉 git 版本管理.

1. 具備5年以上的開發經驗，精通一種或多種開發语言 (Java, C++，Go，Php，Python等)。 2. 熟悉Golang語言，基礎扎實，3年以上Golang開發工作經驗。 3. 熟悉Golang協程，熟悉Channel和鎖，熟悉微服務架構 (GRPC)。 4. 熟悉Redis和MySQL數據庫。 5. 熟悉JSON / Protobuf等種網路通信技術和資料交換格式。 6. 良好的演算法基礎和清晰的程式設計思路。 7. 熟悉TCP/IP、HTTP等網路通訊協定，熟悉websocket。 8. 熟悉Docker，熟悉git版本管理。 9. 有體育產品經驗者優先

1.熟悉 Git/GitHub ，通信協議 TCP/HTTP 及 RESTful 標準。 2.具備3年及以上前端開發經驗，熟悉 React/Angular 框架，掌握 Redux, MobX, gulp 及 webpack ，能獨立開發常用組件。 3.熟悉 TypeScript 或其它靜態類型語言。 4.熟練編寫語意化的 HTML ，模塊化的 CSS 及 SASS 語法。