Thermal Department Leader(3007192)
台北市內湖區
電腦╱週邊設備製造
機械工程主管
面議(經常性薪資4萬含以上)
職務要求
1. Developing, verifying and validation for smart device thermal systems, and co-work with HW, ME, for physical thermal solution design. As well as working with software team for thermal mitigation plan for products.

2. Integrating with multi-objective optimization, analysis and visualization of the entire product design space. Establishing ling-term collaboration with customers, so that we can thoroughly understand their research and needs and can be most productive in minimizing the time to market for new design.

3. Leading thermal team to fulfill customer/products thermal optimization, requirements, and research needs.

4. Analyzing heats transfer and energy conversion components and systems including, but not limited to, thermal optimization on portable devices, e.g. mobile phone, tablet; smart watch, and smart speaker; IOT devices and related applications.

5. Utilize in-house, commercial, and custom developed software to provide customer thermal optimization solutions.

6. Develop, review and edit project reports, and report to customers.

7. Assist with developing proposals and new business leads.

8. Maintain and grow existing customer contact and relations.

任職資格
1. 5-years+ experience on thermal system optimization, and manager experience on thermal team. Familiar with highly goal oriented simulation tools. (E.g. Ansys Icepak)

2. Extensive knowledge about heat transfer and energy conversion system is a must.

3. Ability to independently learn new engineering analysis tools and apply them into projects.

4. Previous research and development experience is preferred.

5. Software developing experience is requested, but not required.

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