選取條件:
AR

資料架構師(Data Architect) (3009828)
台北市士林區
儲配╱運輸物流
數據架構師
面議(經常性薪資4萬含以上)

1.資訊工程、資工、統計、數據工程或相關科系 2.5年以上資料架構 / 大數據平台設計經驗 3.精通資料庫(SQL/NoSQL)、資料建模(Dimensional / ER Model) 4.熟悉雲端資料平台(AWS/Azure/GCP) 5.熟悉 ETL/ELT、資料治理工具(Collibra、DataHub、Informatica 等) 6.具備跨部門溝通能力、能將業務需求轉成技術架構

資料工程師(Data Engineer) (3009827)
台北市士林區
儲配╱運輸物流
數據工程師
面議(經常性薪資4萬含以上)

1.2–5 年以上 Data Engineer 或後端工程經驗,熟悉 Python、SQL、Spark、Airflow、Kafka 等資料工具 2.有雲端資料平台(AWS / GCP / Azure)經驗,熟悉 CI/CD、版本控制、資料品質與資料監控 3.具備基礎資料建模與資料倉儲觀念,主動解決問題能力強,能獨立完成工程實作

業務運籌夥伴(新竹/台北) (3009826)
新竹市東區
IC設計相關
國內業務人員
面議(經常性薪資4萬含以上)

銷售協調(Sales Coordination) • 與 ODM/OEM/JDM 業務開發與業務團隊緊密合作,串接工程、採購與工廠相關單位,保持跨部門溝通順暢。 • 確保專案於試產(Ramp-up)及量產(Mass Production)階段能依時程推動。 • 協助達成整體銷售目標與提升營運效率,支持公司短期及長期業務發展。 預測、訂單與銷售預測管理(Forecast, Order & Sales Forecast Management) • 負責訂單處理與預測管理,提供精準的銷售預測以支援營運規劃。 • 包含長交期零件的採購準備、生產線排程及產能管理,確保客戶訂單準時出貨。 物料準備與管理(Material Preparation & Management) • 與客戶協同檢視長交期零件、MOQ 與交期要求,提前做好物料準備。 • 優化物料管理以避免缺料,並就過量庫存提出協調與解決方案,使物料需求符合營運目標。 應收帳款管理(Accounts Receivable Management) • 確保客戶款項如期回收,妥善管理應收帳款,維持公司良好現金流。

日文/英文業務夥伴 (台北/新竹) (3009730)
台北市內湖區
IC設計相關
國外業務人員
面議(經常性薪資4萬含以上)

1.Global Business Development • Proactively identify and engage with potential B2B customers in key markets (U.S., Japan, Europe, SE Asia, Middle East). • Lead customer pitching, technical consultation, and business model alignment (ODM, JDM, NRE-based models). • Represent capability in AI camera, biometric imaging, and system integration solutions. 2.Account & Project Ownership • Act as the primary business contact for international clients, ensuring alignment across specifications, cost targets, schedules, and deliverables. • Coordinate closely with internal teams (PM, R&D, QA, operations) throughout the ODM project lifecycle. • Manage RFQ/RFP processes, NRE negotiations, and commercial contract finalization. 3.ODM Operations Familiarity • Demonstrate strong understanding of ODM workflows, including customer engagement process, design-to-manufacturing flow, supply chain collaboration, and volume production logistics. • Align product customization and modularization strategies with customer roadmap. 4.Commercial Strategy & Execution • Structure competitive proposals based on BOM breakdown, tooling cost, and regional pricing models. • Negotiate key commercial terms such as MOQ, lead time, IP rights, and payment conditions. 5.Market Intelligence & Customer Insights • Analyze market trends, regional regulations, competitor activities, and customer behavior. • Provide strategic input to internal teams on product positioning and go-to-market plans.

法規品保主管 (3009343)
台北市內湖區
IC設計相關
品管/品保主管
面議(經常性薪資4萬含以上)

(a) In support of Sr Director to manage the regulatory affairs and quality assurance team for compliance with regulatory requirements for medical devices. (b) Have the experience over 10+ years in quality assurance, regulatory, or product verification/validation field of medical devices. (c) Have the experience to oversight the compliance activities cross-sites oversea. (d) Able to travel oversea to monitor and supervise the quality teams.

Sales Manager/Sr. Sales Manager (台北/新竹) (3009020)
台北市內湖區
IC設計相關
國內業務主管
面議(經常性薪資4萬含以上)

1. Business Development: Engage current and new customers to expand AI camera systems solutions to all possible vertical markets including automotive, tracking and logistics, retail , healthcare, security & surveillance, and industrial (agriculture, automation, robotics). Generate new insights from the market and promote internally. 2. Customer Communication and Coordination: Maintain good communication with customers and coordinate with cross-functional teams like PM & RD, and the factory. Have ODM/OEM/JDM working experience and knowledge to consolidate proposals to respond to RFQ/RFP/RFI. 3. BOM and Hardware and Software Knowledge: Know basic knowledge about BOM and hardware and software development processes. Have the ability to review NRE, BOM costs and communicate with RD and sourcing and factory teams for cost-saving methods. 4. Project Operations Management Support: Familiar with ODM/OEM/JDM operations, and capable of supporting handling project issues during NPI, MP, and after-service stages. 5. Negotiation Skills: Have experience in negotiating agreements and business terms and conditions.

PM-專案資深專員/專案主管 (3007762)
新竹市東區
生化科技研發
專案管理主管
面議(經常性薪資4萬含以上)

1. Over 8 years experience of project manager. 2. Excellent communication skills (oral and writing) 3. Self-motivated and self-directed, demonstrated ability to work well with internal and external team members. 4. Bachelor or master degree.

Golang資深工程師 (3009748)
台北市士林區
電腦軟體相關
軟體工程師
面議(經常性薪資4萬含以上)

1. 具備 8–10 年以上後端開發經驗,其中 Go 語言使用 3–5 年(Gin / Fiber 其一),近兩年為主要開發語言,並具備實戰經驗與紮實的標準庫應用能力(context、sync、net/http、testing)。 2. 精通 MySQL 資料庫設計與效能優化,熟悉交易隔離級別(RR/RC)、MVCC、死鎖診斷與索引策略(覆蓋/組合/選擇性)、EXPLAIN / EXPLAIN ANALYZE 解讀及 SQL 重寫。 3. 具備高併發與批次處理經驗,能設計等冪鍵、去重、防重跑、補償與 backoff 機制。 4. 熟悉測試與工程化流程(go test/testify、契約測試觀念、基本 benchmark、GitHub Flow/Actions)。 5. 具備可觀測性思維,能建立 P95/P99、錯誤率、重試率/死信監控,並能定義與落地最小指標集。 6. 具備大型交易/帳務級系統經驗,例如:銀行、支付、大型電商、廣告計費、電信計費等高交易量與對帳場景,或曾 擔任模組 Owner 或主要開發者者尤佳,可提供架構圖、PR/設計文件或效能報告佐證。 7. 能清楚撰寫設計文件、PR 描述與技術說明,並能將技術風險轉化為可供決策的語言。 8. 能提供具體實績佐證(如批次或高併發案例、效能優化報告、EXPLAIN 比較或壓測數據)。 【加分項目】 1. 熟悉事件驅動與訊息佇列(Kafka、RabbitMQ、NATS、Outbox Pattern)。 2. 熟悉 schema 版本治理(Atlas / GORM Migrate)、藍綠/金絲雀發版與回滾機制。 3. 具備k6/JMeter、OpenTelemetry(metrics/logs/traces)之經驗。 4. 熟悉 Windows Server 基礎運維(NSSM、服務帳號、ACL)與反向代理(Apache/Nginx)。 5. 具備帳務或金流領域經驗(對帳、批次結算、月結差異分析、審計需求等)。 6. 具備公開 repo、技術文章、演講或 ADR/Runbook 範例者尤佳。

土城廠工程課課長 (3009815)
新北市土城區
印刷電路板製造業(PCB)
製程主管
面議(經常性薪資4萬含以上)

1. 製程範圍: (相關製程經驗 >5年、下述製程覆蓋率 >70%) Desmear, Plasma, PTH, Copper plating, Cu Via-fill, immersion Tin,Hard gold plating, Laser drill, Laser pretreatment 2. 英文中等

硬體研發工程師-Hardware Engineer (3009261)
台北市內湖區
自動控制相關
電子工程師
面議(經常性薪資4萬含以上)

1. Work with FAE engineers at India site 2. Precision Analog Circuit Design(OP Amp applications, sensor applications) 3. Digital Circuit Design(Logic IC, Interface, High speed Bus Design) 4. AC/DC,DC/DC power circuit design 5. PCB Layout review 6. Validation and calibration process design 7. Testing system development 8. FPGA or MCU development skill would be a plus